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・ Wafang Township
・ Wafangdian
・ Wafangdian West Railway Station
・ Wafangzi mine
・ Wafaq ul Madaris Al Salafiyyah
・ Wafaq ul Madaris Al-Arabia, Pakistan
・ Wafayi
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Wafer (electronics)
・ Wafer (surname)
・ Wafer backgrinding
・ Wafer bonding
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・ Wafer tumbler lock
・ Wafer-level packaging
・ Wafer-scale integration
・ Waferboard
・ WaferCatalyst
・ Wafering
・ WAFF


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Wafer (electronics) : ウィキペディア英語版
Wafer (electronics)

A wafer, also called a slice or substrate,〔
〕 is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.
== History ==

By 1960, silicon wafers were being manufactured in the U.S. by companies such as MEMC/SunEdison. In 1965, American engineers Eric O. Ernst, Donald J. Hurd, and Gerard Seeley, while working under IBM, filed Patent US3423629A〔http://www.google.com/patents/US3424629〕 for the first high-capacity epitaxial apparatus.

抄文引用元・出典: フリー百科事典『 ウィキペディア(Wikipedia)
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